TY - GEN
T1 - Analysis of the performance reduction of axial fans in close proximity to EMC screens
AU - Antón, R.
AU - Bengoechea, A.
AU - Masip, Y.
AU - Rivas, A.
AU - Ramos, J. C.
AU - Larraona, G. S.
PY - 2010
Y1 - 2010
N2 - The performance of axial fans in close proximity to EMC screens has been analyzed by means of an experimental parametric study. The following geometrical parameters have been studied: the hub-to-tip ratio, the ratio between fan thickness and fan diameter, the porosity and the thickness of the perforated plate and finally the distance of the perforated plate to the inlet and the outlet of the fan. The screen porosity has been found to be the most important\ parameter. The distance between the screen and the fan is significant to a certain extent if the screen is placed at the inlet of the fan, otherwise the distance is of no importance.
AB - The performance of axial fans in close proximity to EMC screens has been analyzed by means of an experimental parametric study. The following geometrical parameters have been studied: the hub-to-tip ratio, the ratio between fan thickness and fan diameter, the porosity and the thickness of the perforated plate and finally the distance of the perforated plate to the inlet and the outlet of the fan. The screen porosity has been found to be the most important\ parameter. The distance between the screen and the fan is significant to a certain extent if the screen is placed at the inlet of the fan, otherwise the distance is of no importance.
UR - http://www.scopus.com/inward/record.url?scp=77953697753&partnerID=8YFLogxK
U2 - 10.1109/ESIME.2010.5464583
DO - 10.1109/ESIME.2010.5464583
M3 - Conference contribution
AN - SCOPUS:77953697753
SN - 9781424470266
T3 - 2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010
BT - 2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010
T2 - 2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010
Y2 - 26 April 2010 through 28 April 2010
ER -