Towards Practical Path Loss Predictions in Indoor Corridors Considering 5G mmWave 3D Measurements

M. E. Diago-Mosquera, A. Aragon-Zavala, M. Rodriguez

Research output: Contribution to journalArticlepeer-review

Abstract

Theoretical and empirical foundations of how radio waves behave in practical wireless channels need to be fully revisited for millimeter-wave (mmWave) frequencies so that fifth-generation (5G) technologies may be successful. Kriging is an outstanding geostatistal interpolation technique that employs variography to understand the spatial variability of known samples at specific locations to predict unmeasured samples, based on the fact that there is an implied connection between the measured value and its location in space. The research we here report is aimed at validating the improvement in predictions when this tool is included for mmWave frequency path loss modeling in a long indoor corridor with break. In order to quantify the accuracy of the proposed methodology, it is compared with a well-established procedure described in the literature. Extensive path-loss measurements were collected through specialized narrowband sounders at 28 and 60 GHz. Spatially averaged power measurements using omnidirectional and directive antennas at different heights provided the empirical basis for the three-dimensional (3D) Kriging-aided model. It was found that this method significantly improves the accuracy as it considers all the singularities and site-associated features that are implicit in measured samples. This is important to obtain a reliable path loss model for planning and deployment of mmWave wireless communication systems in indoor scenarios.

Original languageEnglish
Pages (from-to)1-5
Number of pages5
JournalIEEE Antennas and Wireless Propagation Letters
DOIs
StateAccepted/In press - 2022
Externally publishedYes

Keywords

  • 5G mmWave
  • Antenna measurements
  • Horn antennas
  • indoor corridor
  • Kriging
  • Loss measurement
  • path loss model
  • Predictive models
  • Receiving antennas
  • Solid modeling
  • Three-dimensional displays

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