The influence of poly(ethylene oxide) and illumination on the copper electrodeposition process onto n-Si(100)

Eduardo C. Muñoz, Ricardo S. Schrebler, Paula K. Cury, Claudio A. Suárez, Ricardo A. Córdova, Carlos H. Gómez, Ricardo E. Marotti, Enrique A. Dalchiele

Resultado de la investigación: Contribución a una revistaArtículorevisión exhaustiva

21 Citas (Scopus)

Resumen

In this study, we examined the influence of illumination and the presence of poly(ethylene oxide) (PEO) as an additive for the copper electrodeposition process onto n-Si(100). The study was carried out by means of cyclic voltammetry (CV) and the potential steps method, from which the corresponding nucleation and growth mechanism (NGM) were determined. Likewise, a morphologic analysis of the deposits obtained at different potential values by means of atomic force microscopy (AFM) was carried out. In a first stage, Mott-Schottky measurements so as to characterize the energetics of the semiconductor/electrolyte interface were made. Also, parallel capacity measurements were carried out in order to determine the surface state density of the substrate. It was found that when PEO concentration is increased, the number of these surface states decreases. The CV results indicated that the presence of PEO inhibits the photoelectrochemical reaction of oxide formation on the surface of the semiconductor. This allows a decrease in the overpotential associated with the electrodeposition process. The analysis of the j/t transients shows that the NGM corresponds to progressive three-dimensional (3D) diffusional controlled (PNSDDiff), which was confirmed by the AFM technique. Neither illumination nor the presence of PEO changes the mechanisms. Their influence is in that they diminish the size of the nuclei and the speed with which these are formed, which produces a more homogeneous electrodeposit.

Idioma originalInglés
Páginas (desde-hasta)21109-21117
Número de páginas9
PublicaciónJournal of Physical Chemistry B
Volumen110
N.º42
DOI
EstadoPublicada - 26 oct 2006
Publicado de forma externa

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